Follow
Bo Pu
Bo Pu
IEEE Senior Member, Missouri Univ. of Science and Technology
Verified email at mst.edu
Title
Cited by
Cited by
Year
Semiconductor Package and Method of Manufacturing the Same
B Pu, J Pak, JY Park, S Nam
US Patent 20,210,028,100, 2019
71*2019
Modeling and parameter extraction of coplanar symmetrical meander lines
B Pu, KH Kim, SY Kim, W Nah
IEEE Transactions on Electromagnetic Compatibility 57 (3), 375-383, 2015
242015
Efficient DC and AC impedance calculation for arbitrary-shape and multilayer PDN using boundary integration
L Zhang, J Juang, Z Kiguradze, B Pu, S Jin, S Wu, Z Yang, EP Li, J Fan, ...
IEEE Transactions on Signal and Power Integrity 1, 1-11, 2022
232022
Electromagnetic susceptibility analysis of ICs using DPI method with consideration of PDN
B Pu, JJ Lee, SK Kwak, SY Kim, W Nah
2012 Asia-Pacific Symposium on Electromagnetic Compatibility, 77-80, 2012
172012
A modified genetic algorithm for the selection of decoupling capacitors in pdn design
J Juang, L Zhang, Z Kiguradze, B Pu, S Jin, C Hwang
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 712-717, 2021
152021
Fast impedance prediction for power distribution network using deep learning
L Zhang, J Juang, Z Kiguradze, B Pu, S Jin, S Wu, Z Yang, J Fan, ...
International Journal of Numerical Modelling: Electronic Networks, Devices …, 2022
142022
A novel machine-learning-based batch selection method in sparse near-field scanning
L Zhang, YR Feng, B Pu, XD Cai, D Li, XC Wei, B Mutnury, J Fan, H Chen, ...
IEEE Transactions on Microwave Theory and Techniques 70 (11), 5019-5028, 2022
132022
Training set optimization in an artificial neural network constructed for high bandwidth interconnects design
B Pu, H Kim, XD Cai, B Sen, C Sui, J Fan
IEEE Transactions on Microwave Theory and Techniques 70 (6), 2955-2964, 2022
112022
Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin
B Pu, J He, A Harmon, Y Guo, Y Liu, Q Cai
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 492-497, 2021
102021
Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent
Y Guo, S Yong, Y Liu, J He, B Pu, X Ye, A Sutono, V Kunda, A Luoh, ...
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 820-824, 2021
102021
Immunity enhancement of the power distribution network in integrated circuits with coplanar meander lines in package
B Pu, J Fan, W Nah
IEEE Transactions on Electromagnetic Compatibility 62 (5), 2238-2246, 2020
102020
The simulated TDR impedance in PCB material characterization
Y Guo, DH Kim, J He, S Yong, Y Liu, B Pu, X Ye, J Fan
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 831-834, 2021
92021
Prepreg and Core Dielectric Permittivity (ϵr) Extraction for Fabricated Striplines’ Far-End Crosstalk Modeling
S Yong, S Penugonda, DH Kim, V Khilkevich, B Pu, X Ye, Q Gao, XD Cai, ...
IEEE Transactions on Electromagnetic Compatibility 64 (1), 209-218, 2021
92021
Design of 2.5 D interposer in high bandwidth memory and through silicon via for high speed signal
B Pu, JS Pak, C Jo, S Moon
UBM DesignCon Conference, 2019
72019
A de-embedding technique of a three-port network with two ports coupled
B Pu, J Kim, W Nah
Journal of electromagnetic engineering and science 15 (4), 258-265, 2015
72015
Estimation of transferred power from a noise source to an IC with forwarded power characteristics
B Pu, T Kim, SJ Kim, JH Kim, SY Kim, W Nah
Journal of electromagnetic engineering and science 13 (4), 233-239, 2013
72013
Novel Formulations of Multireflections and Their Applications to High-Speed Channel Design
M Ouyang, XD Cai, B Pu, Q Gao, S Penugonda, C Li, B Sen, C Hwang, ...
IEEE Transactions on Signal and Power Integrity 1, 43-54, 2022
62022
Fast PDN impedance prediction using deep learning
L Zhang, J Juang, Z Kiguradze, B Pu, S Jin, S Wu, Z Yang, C Hwang
arXiv preprint arXiv:2106.10693, 2021
62021
Prediction of impedance characteristics of MLCC using multiconductor transmission line theory
J Jeon, H Lee, B Pu, JH Kim, N Zhang, W Nah
IEEE Transactions on Electromagnetic Compatibility 58 (6), 1760-1771, 2016
62016
Analysis of filtering characteristics for coplanar symmetrical meander lines
B Pu, K Kim, J Yousaf, W Nah
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility …, 2016
52016
The system can't perform the operation now. Try again later.
Articles 1–20